AEA

AEA
メニュー
日本

TopoLogic Inc.

TopoLogic develops high performance semiconductor technology using the unique properties of topological material. The technology is based on research at the University of Tokyo, one of the leading research institutions in this research field. TopoLogic’s technology leverages the unique electronic, spintronic, and thermoelectric properties of topological material. TopoLogic currently focuses on 2 technologies. First is TL-RAM, a new type of high-speed non-volatile memory which is 10x more energy efficient compared to conventional memory devices. Second is TL-SENSING, a MEMS thermal sensor technology which can detect heat fluctuations 100 times faster than conventional sensors. TopoLogic has filed over 30 patents since 2022, and also secures the fundamental patents from the University of Tokyo through exclusive licensing agreements. Development continues with strong collaboration with Professor Nakatsuji at the University of Tokyo, who is also our co-founder, and joint PoCs with multiple Japanese corporations in the automotive, industrial equipment, and semiconductor related industries.

https://www.topologic.jp/

TAIKI SATO
Chief Executive Officer

Nominated by

TAKETO SUGAWARA – 日本
Director, Incubation and Entrepreneurship Education
The University of Tokyo
TopoLogic is a deeptech startup spun out from the University of Tokyo, which develops high performance semiconductor memory technology and heat sensor technology using topological materials. It’s semiconductor memory technology and heat sensor technology have a significant social impact and the potential to solve pressing global issues. One is increasing power demand resulting from the rapid development of software technologies such as AI, and the other is delicate thermal control within high-performance equipment such as EV batteries. TopoLogic has already completed several PoCs and is now considering global expansion through partnership.